oth the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semi-conductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers.
Heat Sink Types
Stampings /Extrusion /Bonded/Fabricated Fins/Castings/Folded Fins
For example, in order to determine the actual thermal performance of a heat sink at altitudes other than the seal level, the thermal resistance values read off from the performance graphs should be divided by the derating factor before the values are compared with the required thermal resistance.
