Industry News

Custom-designed for fanless operation from the ground up, the Heat Sink is capable of cooling modern high-end CPUs with low to moderate heat dissipation completely passively in enclosures with good natural convection.

Power densities in electronic subsystems continue to increase, driving demand for more cooling power alternatives that increasingly include liquid cooling as a viable candidate. To optimize thermal management efficiency, sustainability and reliability, designers of systems that use liquid cooling are exploring innovative combinations of component materials, including advanced thermoplastics,

There are trends that are driving the need for thermal interface solutions in the electronics marketplace. The first, is data consumption. As devices get more powerful to handle the amount of data that is being transferred over our IP networks, they are generating more heat. We’ve all heard of terabytes, gigabytes, megabytes, what about exabytes? A friend of mine, Larry, thinks the next one will be yotabytes.

We got a couple of questions embedded in here and it’s just sort of to get an idea. For example, this one, “Do you currently have a good understanding of when and how to utilize vapor chambers, as opposed to heat pipes?” So, we just get a feeling of feedback from the audience as to what their expertise level is, so if you can go ahead and vote on that and we’ll take a look at the results later on today.

YY Thermal now provides fans heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecomm, optics, test/measurement, military and other applications.

Generative design is an iterative design process that use of a program to generate a set of optimized designs that meet product performance requirements, Methods that transform statements of performance requirements into product designs are also known as inverse design methods

With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design.

For cost reduction I was thinking about the following:Complete Aluminium spreader block like in the other sample we received, instead of half copper.

There are two kinds of mobile phone heat dissipation: Active heat dissipation and passive heat dissipation. The basic idea is to reduce the thermal resistance of mobile phone heat dissipation, among which (passive heat dissipation) or reduce the calorific value of mobile phone.

In daily life, any mechanical parts will be covered with dust after being used for a long time, and too much dust will also lead to the instability of the circuit and heat dissipation of the machine and hidden risks, just like the example around us: if the heat dissipation of the computer CPU is poor, it will easily lead to computer crash, automatic restart, slow operation and even CPU damage.

In our daily impression, the cooling system of PC computers generally uses air-cooled radiator, that is, aluminum fin sheet is attached to heat pipe and combined with fan to blow heat, and the air circulation in main box is used to keep the temperature of CPU heat source in the range of 20-60℃.

As we all know, the traditional radiator has a simple structure, only the heat pipe, fin chip and the contact bottom surface made of copper and aluminum, and even the heat sink is just the base of fin chip and flat surface produced by the simplest aluminum extrusion process, but it is widely used.